Failure & Yield Analysis Products

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WFA-02 Wafer Failure Analysis for Yield Enhancement
(Accelerated Analysis, 2002)
  Author's Note  (.pdf  77KB / 2 pages)
  Table of Contents  (.pdf  100KB / 4 pages)

In this practical evolving text authors David Burgess and Dr. Richard Blanchard focus on problems encountered in today's global semiconductor setting.  Explanations of failure and yield mechanisms begin at observable symptoms and follow through to causes and corrective action.  The  goal of the WFA book (and the seminar) is to demonstrate a proven failure analysis approach to solve problems quickly.

The following is an abbreviated table of contents:
Introduction / Overview
The Process & The Approach
Yield Reduction Mechanisms:
     Design
     Process
     Assembly
     Test
Electrical Fault Isolation
Physical Fault Localization
Sample Preparation Techniques
Analytical Techniques
Test Structures
Equipment
Appendices:
    Charts and Tables
    Acronyms and Abbreviations
    Glossary
    Resources

FAIC-99 Failure Analysis of Integrated Circuits: Tools and Techniques
(Kluwer, 1999)

This book, edited by Dr. Lawrence Wagner, consists of 15 chapters written by recognized leaders in semiconductor failure analysis.  It is an excellent reference for analysis techniques and methods.

This list of chapter titles reveals its scope of coverage:
Introduction
Electrical Characterization
Package Analysis: SAM and X-ray
Die Exposure
Global Failure Site Isolation: Thermal Techniques
Failure Site Isolation: Photon Emission... , Optical/E-Beam Techniques
Probing Technology for IC Diagnosis 
Deprocessing
Cross-section Analysis
Inspection Techniques
Chemical Analysis
Energy Dispersive Spectroscopy
Auger Electron Spectroscopy
Secondary Ion Mass Spectrometry, SIMS
Failure Analysis Future Requirements

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